Milestones三金公司发展历程
1997
福建省南平市三金电子有限公司成立
SANJIN Electronics was established
2004
福建省职工优秀技术创新成果三等奖
Third Prize, Provincial Workers' Excellent Tech Innovation
2005
“SMD陶瓷晶振外壳配套的金属盖板”通过国家科技部鉴定
"Metal Lid for SMD Ceramic Oscillator" certified by National Ministry of Science and Technology
2006
“黑瓷扁平外壳”通过鉴定,同年获得《集成电路黑陶瓷
低温玻璃外壳引线连接框架-实用新型专利证书》
"Black Ceramic Flat Package" certified;
Utility Patent for "Low-Temp Black Ceramic Glass IC Package Lead Frame"
2007
荣获“海峡两岸职工创新成果银奖”
Silver Award, (CSWI) Cross-Strait Workers' Innovation
2008
获得国家高新技术企业称号和福建省创新型试点企业,
同年公司正式迁入高新区新厂房
Awarded "National High-Tech Enterprise" and Fujian Province Innovative Pilot Enterprise.
Relocated to a new factory in the Nanpin High-Tech Zone.
2011
获得《电子封装金属盖板生产工艺-发明专利证书》,并正式成为福建省创新型企业Invention Patent for "Metal Lid Production"; Fujian Innovative Enterprise
2013
荣获海峡两岸职工创新成果金奖;省科技厅授予“陶瓷封装材料企业工程技术研究中心”
Gold Award for CSWI; "Ceramic Package Materials Enterprise Engineering Research Center"
by Provincial Ministry of Science and Technology
2014
获批成为高新技术企业 Certified High-Tech Enterprise
2015
连续六年被评为福建省南平市“纳税大户” Top Taxpayer in Nanping for six years
2016
成为“福建省南平市知识产权优势企业”,通过“企业安全生产标准化”三级证书
Intellectual Property Advantage Enterprise in Nanping; Safety Production Standar-dization Level 3
2017
IC封装项目正式启动 IC Packaging Project launched
2018
建设高可靠黑瓷低熔玻璃IC封装生产线,被评为福建省“专精特新”中小企业。
Built IC packaging line of High-Reliability Low-Temp Black Ceramic; Niche Leader in Fujian.
Provincial Specialized Niche Leader
2019
荣获科技小巨人领军企业 Awarded Leading Technology Niche Enterprise
2020
评为国家级“专精特新”小巨人企业,成立子公司福建省创鑫微电子有限公司
National Specialized Niche Leader; funded CHUANGXIN Microelectronics
2022
通过IATF16949质量管理体系认证;福建省数字经济领域“未来独角兽”创新企业
IATF16949 Certification;
Fujian Digital Economy "Future Unicorn" Innovation Enterprise